The process of spunlacing or "hydroentangling" is perhaps the fastest growing technology in the nonwovens field. The principle is unique unto itself-ultra fine, high velocity jets or "needles" of water are volleyed against a fiber web or other similar substrate. The kinetic energy transferred from the water causes the fibers to entangle,wrap, and knot about each other in the web. The resulting product is one with many conventional textile properties such as softness of hand, drapability, durability, and the ability to be patterned. Spunlaced nonwovens are expanding into new and heretofore difficult to penetrate markets such as apparel, home furnishings, and domestics. Moreover, end use products such as personal wipes, domestic wipes, and institutional wipes continue to grow for spunlaced nonwovens. Industry experts estimate that approximately 12% of all nonwovens are made through the spunlaced process. Vital to the success or failure of the hydroentangling process is the spunlace jetstrip. The jetstrip is the key critical component that determines the overall characteristics of the nonwovens produced. The jetstrip is the metal strip with many small orifices through which water is pumped at extremely high pressures. It is therefore critical to have a jetstrip made to withstand high pressures while simultaneously producing accurate uniform, needles of water that will deliver energy powerfully and efficiently.

Nippon Nozzle has a unique technology regarding the manufacture of spunlace jetstrips. This proprietary knowledge and the custom manufacturing capabilities allow Nippon Nozzle to manufacture spunlace jetstrips with capillary diameters significantly smaller than 100 microns while still maintaining the highest degrees of accuracy, quality, and energy from the waterjet needles. This can help conserve energy, which spunlacing lines use a great deal of. Additionally, Nippon Nozzle's proprietary process results in jetstrips with much "smoother" capillary bores and capillaries that are far more perpendicular to the jetstrip than many others commercially available. This results in straighter water needles packing more kinetic energy. This is very significant as Nippon Nozzle jetstrips may yield higher entanglement efficiency, reduced production seconds, and tend to use less water and energy-which are significant costs in the hydroentanglement process.

iConditionsj
1. Used Nippon Nozzle standard holder.
2. Material of strip is SUS631 and holder is SUS630
3. Following figures of water consumtion and velocity of water jet are per our calculation.
4. Water jet is from countersink side to capillary side

 

Water pressure. Capillary diameter(mm) ikgf/cm^2j 0.08 0.1 0.120 0.14 50 0.027 0.042 0.060 0.082 100 0.038 0.059 0.085 0.116 150 0.046 0.072 0.104 0.142 200 0.053 0.083 0.120 0.164 250 0.060 0.093 0.134 0.183 300 0.065 0.102 0.147 0.200 350 0.071 0.110 0.159 0.216 400 0.076 0.118 0.170 0.231 450 0.080 0.125 0.180 0.245 500 0.084 0.132 0.190 0.259 550 0.089 0.138 0.199 0.271 600 0.092 0.145 0.208 0.283 650 0.096 0.150 0.217 0.295 700 0.100 0.156 0.225 0.306 Water consumtioniLiter^min./hj

Water pressure. Capillary diameter(mm) ikgf/cm^2j 0.08 0.1 0.120 0.14 50 89 89 89 89 100 125 125 125 125 150 153 153 153 153 200 177 177 177 177 250 198 198 198 198 300 217 217 217 217 350 234 234 234 234 400 250 250 250 250 450 266 266 266 266 500 280 280 280 280 550 294 294 294 294 600 307 307 307 307 650 319 319 319 319 700 331 331 331 331 Water jet velocityimeter/sec.j

Nippon Nozzle is an important supplier to the Nonwoven industries. We are the leader in supplying spunlace dies and have developed many innovative products and systems for spunlace since 1970.
Nippon Nozzle supplies the following products; spunlace dies and accessories, meltblown dies and spunbond dies.
Refer the page for Spinning Blown, developed by Nippon Nozzle

 

Processed products made from Nippon Nozzle products

disposable diapers, diaper covers, sanitary napkins, dust masks, automobile parts and interior trims, artificial leather, vacuum cleaner filters, electronic device components (floppy disk, etc.), speaker diaphragms, cell separators, etc.